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Wearable Products HDI High Density Interconnection PCB
HDI printed circuit board for wearable products is a high density interconnection printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of Shengyi s1000-2m material, surface gold deposition and laser drilling. The minimum line width and line spacing can reach 60 / 60um, the minimum aperture can reach 0.2mm, and the minimum laser drilling can reach 0.1mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
Min. 10L | 0.55 | 0.45 | 0.4 | |
Min. 12L | 0.65 | 0.6 | 0.55 | |
MAX. | 2.4 | |||
Min. Core Thickness ( um ) | 50 | 40 | 40 | |
Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
Item | HDI Advanced Technology | |||
2019 | 2020 | 2021 | ||
Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
< 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
Laser directly | +/- 50 | +/- 50 | +/- 50 | |
Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG |
Packaging & Delivery | |||||
Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. | ||||
Port: | Shenzhen or Hongkong | ||||
Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
Est. Time(days) | 20 | 21 | 25 | To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China